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Solvents for Photoresist

IP.com Disclosure Number: IPCOM000050282D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Schmitt, GP: AUTHOR [+2]

Abstract

A high boiling-point organic solvent, such as butyl CARBITOL*, is useful in developing photoimageable coatings based on epoxide-acrylate resin chemistry. Butyl CARBITOL does not dissolve acrylic photopolymers; however, diethyl CARBITOL solvent can be used to develop both acrylic and epoxide resin photopolymers, while not attacking that portion of the coating film which has been subjected to prior actinic radiation.

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Solvents for Photoresist

A high boiling-point organic solvent, such as butyl CARBITOL*, is useful in developing photoimageable coatings based on epoxide-acrylate resin chemistry. Butyl CARBITOL does not dissolve acrylic photopolymers; however, diethyl CARBITOL solvent can be used to develop both acrylic and epoxide resin photopolymers, while not attacking that portion of the coating film which has been subjected to prior actinic radiation.

Diethyl CARBITOL dissolves unexposed coating and does not attack the exposed portion (i.e., the coating portion which remains on printed circuit boards as a solder mask protective coat.) Diethyl CARBITOL can be used as a common developing solvent for many commercially known photosensitive solder masks. It is commercially available and is a significantly slower evaporating solvent. Therefore, less solvent will be lost due to evaporation. It is considered a combustible solvent having fewer restrictions than one rated flammable. * Trademark of Union Carbide Corporation.

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