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Glass Free Molybdenum Conductive Patterns on Ceramic Substrates

IP.com Disclosure Number: IPCOM000050288D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Fury, MA: AUTHOR [+3]

Abstract

This molybdenum metallurgy prevents glass infiltration into the molybdenum surface features, thereby making the surface more receptive to subsequent plating operations.

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This is the abbreviated version, containing approximately 100% of the total text.

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Glass Free Molybdenum Conductive Patterns on Ceramic Substrates

This molybdenum metallurgy prevents glass infiltration into the molybdenum surface features, thereby making the surface more receptive to subsequent plating operations.

Multilayer ceramic substrates are prepared by co-sintering molybdenum circuit features and a supporting substrate made of a ceramic composition consisting predominantly of alumina with approximately 10-20 percent volume percent of a bonding glass frit. At or below the sintering temperature the glass frit so used becomes fluid enough to penetrate the as yet poorly sintered molybdenum conductor patterns. While such glass penetration provides good adhesion of the molybdenum pads to the ceramic substrates, it causes problems in the surface molybdenum circuit features when they are subsequently plated or joined to other metals.

In this molybdenum conductor pattern, palladium is added to the molybdenum paste used to produce the features in amounts below or in excess of the solubility limit of palladium in molybdenum. The palladium catalyzes the molybdenum sintering so that it occurs below the fluid temperature of the glass. This early densification prevents migration of glass into the molybdenum, thereby causing the formation of a continuous molybdenum metal surface that is receptive to subsequent plating operations.

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