Browse Prior Art Database

System for Controlling Saw Blade Excursions During the Slicing of Silicon Crystals

IP.com Disclosure Number: IPCOM000050293D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Carufe, PR: AUTHOR [+4]

Abstract

This article describes a system for monitoring and automatically correcting deviations from a desired path of a slicing blade used to cut silicon wafers from an ingot, which deviations result in bowing and warpage of the wafers cut. The system features a blade deviation detector and eads responsive to the detector for correcting the deviation by the introduction of a compensating fluid at the blade edge.

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System for Controlling Saw Blade Excursions During the Slicing of Silicon Crystals

This article describes a system for monitoring and automatically correcting deviations from a desired path of a slicing blade used to cut silicon wafers from an ingot, which deviations result in bowing and warpage of the wafers cut. The system features a blade deviation detector and eads responsive to the detector for correcting the deviation by the introduction of a compensating fluid at the blade edge.

A system in accordance with the teaching of this article is shown in Fig. 1. The system includes a blade deviation detector 1, of the reluctance type well known in the art, having a reluctance probe sensor 2 connected to a reluctance probe demodulator 3. Additionally, the system includes a controller 4 for receiving detector 1's output and generating a feedback control signal to be used for decreasing blade deviation. Finally, the system includes a means 5 for correcting blade deviation responsive to the output signal from controller 4. Control means 5 itself includes an electrical to pressure transducer 6 for converting the electrical correction signal supplied by controller 4 to a pressure signal and a fluid distribution nozzle, adjacent to the blade whose deviation is to be corrected, which supplies fluid responsive to the pressure signal of transducer
6.

In operation, slicing blade 8 experiences excursions perpendicular to the plane of the blade while cutting a silicon crystal....