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Method for Manufacturing Porous Metal Devices

IP.com Disclosure Number: IPCOM000050294D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Moore, RJ: AUTHOR [+3]

Abstract

A method is provided for manufacturing porous copper devices for use in the removal of unwanted sold from circuit substrates in the manufacture, working, and repair of electronic components. This device, when heated, can be used to remove by absorption materials which have melting points lower than copper and can be wetted or joined to the copper. This method can be used with metals other than copper in order to absorb higher melting point materials, alloys or glasses.

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Method for Manufacturing Porous Metal Devices

A method is provided for manufacturing porous copper devices for use in the removal of unwanted sold from circuit substrates in the manufacture, working, and repair of electronic components. This device, when heated, can be used to remove by absorption materials which have melting points lower than copper and can be wetted or joined to the copper. This method can be used with metals other than copper in order to absorb higher melting point materials, alloys or glasses.

Copper powder of loose density of about 2.6 grams per cubic centimeter is overflowingly filled into the cavity of a mold which Is made of graphite electrode material, stainless steel, or any other suitable material. The mold can be multi- cavity and does not require a draft angle due to the percent of shrinkage of the copper. The mold is vibrated for 30 seconds, and the cover powder is leveled evenly across the top of the mold cavity. The cavity is covered with a flat piece of mold material and the mold is placed in a belt furnace at a temperature of 890 degrees C with an atmosphere of disassociated ammonia flowing at 300-400 CFH.

After one-hour sintering, the mold is withdrawn from sintering temperature at a belt speed of five centimeters per minute to room temperature and is cooled in a nitrogen atmosphere for half an hour before removing the porous copper devices from the mold. The copper devices may be coined to obtain a desired dimension, flatness,...