Browse Prior Art Database

Holder Device for Handling Semiconductor Wafers

IP.com Disclosure Number: IPCOM000050314D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Delannoy, G: AUTHOR

Abstract

In an automatic semiconductor wafer production line, it is often desired to automatically load (unload) the wafers onto (from) a smooth, polished surface, such as an electrode of a plasma etcher.

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Holder Device for Handling Semiconductor Wafers

In an automatic semiconductor wafer production line, it is often desired to automatically load (unload) the wafers onto (from) a smooth, polished surface, such as an electrode of a plasma etcher.

Typical handling has been performed so far with a vacuum TEFLON* nozzle; however, this technique presents several limitations or drawbacks.

This article describes a holder device which is able to lay down, pick up and carry wafers without contacting the active face of the wafers, therefore drastically reducing the risk of physical damage. In addition, this holder device may be used in a nitrogen environment which is very useful in fully automated machines.

The holder 10, which is represented in the figure, takes advantage of the chamfered corners 11 of wafer 12 (*). Certain features of the design of the tips 13 of each gripper 14 are of great importance: the opening (angle A) is machined to be straight, while angle B must be about 35 degrees. Picking-up operation

The wafer is disposed on the polished surface, e.g., an electrode, and the holder device aligned above it. The opening of the grippers is 2 mm wider than the wafer diameter. The holder is lowered until the tips 13 contact the electrode surface. Then the grippers 14 are actuated and tighten the wafer which is maintained within the internal angle of the tips. The wafer may now be handled for any subsequent processing step. Laying operation

The holder device maintaini...