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Simplified Production of Printed Circuit Boards by the Additive Process

IP.com Disclosure Number: IPCOM000050316D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Mueller, H: AUTHOR [+3]

Abstract

A simplified method for circuitizing epoxy resin impregnated glass fiber laminates (prepregs) by the additive process is described. This method dispenses with the thin copper foil previously laminated on the prepreg.

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Simplified Production of Printed Circuit Boards by the Additive Process

A simplified method for circuitizing epoxy resin impregnated glass fiber laminates (prepregs) by the additive process is described. This method dispenses with the thin copper foil previously laminated on the prepreg.

The prepreg, provided with via holes, is roughened by means of an Al(2)O(3) vapor blast slurry. This ensures that the subsequently cathode-sputtered very thin copper layer, serving as a seeding layer for circuitization, satisfactorily adheres to the prepreg. Using a photoresist mask, lines are applied to this copper layer in a known manner by electroless copper deposition. After the lines have reached the desired thickness, the photoresist mask is removed and the seeding layer is flash-etched from the bared areas. As the seeding layer is very thin, the lines need not be provided with a protective tin coating during flash- etching.

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