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Browse Prior Art Database

Interface Metallurgy for Mercury Contacts

IP.com Disclosure Number: IPCOM000050410D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Gupta, D: AUTHOR [+2]

Abstract

Mercury (Hg) may be used as an electrical connecting material between circuit chips and circuit cards, providing an electrical interconnection for contacting pins which are inserted in the liquid Hg. Contact power pads of some metals, such as Nb, are not wettable by liquid Hg. Pt layers are used to provide wettability for the contact pads; however, the Hg chemically attacks the Pt layer. To protect the Pt surface, a thin layer of an intermetallic-forming material is deposited on the Pt surface. Examples of such materials include Cu, A1, In, Sn, etc. Amalgamation of these materials by Hg occurs rapidly at room temperature upon exposure to Hg, and the altered Pt surface acts as a barrier to rapid Hg penetration.

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Interface Metallurgy for Mercury Contacts

Mercury (Hg) may be used as an electrical connecting material between circuit chips and circuit cards, providing an electrical interconnection for contacting pins which are inserted in the liquid Hg. Contact power pads of some metals, such as Nb, are not wettable by liquid Hg. Pt layers are used to provide wettability for the contact pads; however, the Hg chemically attacks the Pt layer. To protect the Pt surface, a thin layer of an intermetallic-forming material is deposited on the Pt surface. Examples of such materials include Cu, A1, In, Sn, etc. Amalgamation of these materials by Hg occurs rapidly at room temperature upon exposure to Hg, and the altered Pt surface acts as a barrier to rapid Hg penetration.

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