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Josephson Packaging Technique

IP.com Disclosure Number: IPCOM000050419D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Chang, WH: AUTHOR

Abstract

In Josephson technology, a package is known wherein Josephson circuit boards are arranged perpendicularly to a horizontal board carrying a ground plane. The circuit board contains Josephson device circuits, a ground plane, and a signal line. In this package, the gaps between the vertical boards and the horizontal board introduce inductance discontinuities which limit the speed of the Josephson circuits. In order to overcome this, V-grooves several mils deep are etched in the top surface of the horizontal board, and the vertical circuit boards are bonded to these V-grooves. This results in a structure in which the vertical circuit boards are arranged at an angle less than 90 degrees to the horizontal board.

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Josephson Packaging Technique

In Josephson technology, a package is known wherein Josephson circuit boards are arranged perpendicularly to a horizontal board carrying a ground plane. The circuit board contains Josephson device circuits, a ground plane, and a signal line. In this package, the gaps between the vertical boards and the horizontal board introduce inductance discontinuities which limit the speed of the Josephson circuits. In order to overcome this, V-grooves several mils deep are etched in the top surface of the horizontal board, and the vertical circuit boards are bonded to these V-grooves. This results in a structure in which the vertical circuit boards are arranged at an angle less than 90 degrees to the horizontal board.

In the drawing, a horizontal Si board 10 has a ground plane 12 located thereon. This ground plane is continuous across the surface of board 10, and is present in the Vgroove 14. A signal line 16 is also located on board 10, but is patterned so that it is not continuous across the top surface of board 10.

Silicon boards 18 contain Josephson junction circuits and are bonded to horizontal board 10 by solder contacts 20. Boards 18 contain signal lines 22 and ground planes 24.

Since the ground plane 24 can be made to overlap the ground plane 12 in the V-groove regions, the discontinuity of the inductances between the horizontal and the vertical boards will be smaller. The signals on the horizontal board can be distributed through a conv...