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Browse Prior Art Database

Process for Image Reversal

IP.com Disclosure Number: IPCOM000050469D
Original Publication Date: 1982-Nov-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Greschner, J: AUTHOR [+3]

Abstract

The pattern in a first resist layer is used as a mold for producing the negative of that pattern in a second resist.

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Process for Image Reversal

The pattern in a first resist layer is used as a mold for producing the negative of that pattern in a second resist.

Figs. 1 to 4 are cross-sectional views of a pattern obtained by the described process at different stages of production. A pattern with a ditch 3 in a resist layer 2 on a substrate 1 is shown in Fig. 1. The widest lateral dimension of ditch 3 is < 20 Mum. A second resist layer 4 is spin-coated onto the substrate, selecting resist layer 4 in such a manner that resist layer 2 can be dissolved without adversely affecting resist layer 4. Fig. 2 shows the structure with a planar surface existing at that stage. By reactive ion etching in a CF(4) or an O(2) atmosphere, resist layer 4 is etched until resist layer 2 is exposed (Fig. 3). In the last process step, resist layer 2 is dissolved, leaving the negative of the original pattern, as shown in Fig. 4. As a comparison of Figs. 1 and 4 shows, the process produces the reversal of both the pattern and the slopes.

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