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Method of Cleaning Throughholes in Laminated Printed Circuit Boards

IP.com Disclosure Number: IPCOM000050470D
Original Publication Date: 1982-Nov-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Hinkel, H: AUTHOR [+5]

Abstract

In a plasma reactor, gas streams containing excited ions are sucked through the throughholes in laminated printed circuit boards. The ions react with the material to be removed, and the reaction products are carried off by the gas streams.

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Method of Cleaning Throughholes in Laminated Printed Circuit Boards

In a plasma reactor, gas streams containing excited ions are sucked through the throughholes in laminated printed circuit boards. The ions react with the material to be removed, and the reaction products are carried off by the gas streams.

The figure shows a schematic cross-sectonal view of a plasma reactor suitable for this method. The reactor contains in a reaction chamber 1 an RF driven plate-shaped anode 2 and a reticular cathode 3 arranged parallel thereto. Board 4 to be cleaned, having throughholes perpendicular to the board surface, is arranged on cathode 3 or close to it. The gap between board 4 and the wall of reaction chamber 1 is sealed to be gas-tight by gasket 5 surrounding board 4. Through gas inlet 6, the reactive gas is introduced into reaction chamber 1, and through gas outlet 7, the gas is sucked from reaction chamber 1 by a vacuum pump (not shown). Plasma 6 is produced from the reactive gas in the space between the electrodes.

Smear, primarily consisting of organic substances and contaminating the throughholes in laminated board 4, is capable of reacting with reactive particles. If the gas in reaction chamber 1 is sucked off through outlet 7, gas containing reactive particles passes the throughholes here the reactive particles contact the smear. The reaction products are carried off by the gas stream.

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