Browse Prior Art Database

Personalization of Circuit Devices Using Metal Deposition without Mask for Previously Opened Connection

IP.com Disclosure Number: IPCOM000050484D
Original Publication Date: 1982-Nov-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Colao, R: AUTHOR [+3]

Abstract

In a circuit that is to be personalized by etching through a first metal conductor and depositing metal at an initially formed gap to complete a connection in a second conductor, the etch step is allowed to undercut the metal. In the subsequent metal deposition step, the insulation overhanging the undercut metal forms a sufficient mask to prevent reconnecting the broken conductor without a separate mask step.

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Personalization of Circuit Devices Using Metal Deposition without Mask for Previously Opened Connection

In a circuit that is to be personalized by etching through a first metal conductor and depositing metal at an initially formed gap to complete a connection in a second conductor, the etch step is allowed to undercut the metal. In the subsequent metal deposition step, the insulation overhanging the undercut metal forms a sufficient mask to prevent reconnecting the broken conductor without a separate mask step.

Some integrated circuit devices have an array of field-effect transistors and interconnecting signal lines and power lines. In personalizing the device, a previous connection from gate to ground is broken by etching, and a connection from the gate to one of two signal lines is made by depositing metal to bridge one of the originally existing gaps. The metal deposition step must not reconnect the gap in the connection of the gate to ground. Undercutting the metal during the etched step avoids the mask step that is otherwise required to protect the etched area during metal deposition.

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