Browse Prior Art Database

Package for Memory Arrays

IP.com Disclosure Number: IPCOM000050502D
Original Publication Date: 1982-Nov-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Balderes, D: AUTHOR [+2]

Abstract

High density, high power logic modules requiring liquid cooling are mounted in a planar board arrangement. On the same planar board, air-cooled, high density memory chip carriers are mounted, and interconnected to the logic via the same planar board. This allows for a short communication distance to main memory.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Package for Memory Arrays

High density, high power logic modules requiring liquid cooling are mounted in a planar board arrangement. On the same planar board, air-cooled, high density memory chip carriers are mounted, and interconnected to the logic via the same planar board. This allows for a short communication distance to main memory.

The memory carriers have a chip conventionally mounted on a chip carrier with beam leads connected between circuits on the chip and conductors on the chip carrier. The chip carrier has a rim at its edge and a lid that fits over the edge to seal the module. Solder balls on the edge of the rim make an electrical connection between the module and a module carrier. Thus, the surface of the chip carrier that would normally have connecting pins and face the module carrier is open to cooling air. There is a short direct heat transfer path from the chip through the chip carrier to the air.

The drawing shows a section of the module. The module 2 supports a conventional chip 3 with conventional beam leads 4. The chip carrier has a rim portion 5 that carries a lid 6. Solder balls 7 on the outer face of the rim are connected to a circuit card 8.

Card 8 connects to a board 9 that carries other memory cards and also carries logic circuits that are water-cooled. Surface 10 of the chip carrier is open to cooling air.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]