Browse Prior Art Database

Chip Identification Techniques

IP.com Disclosure Number: IPCOM000050565D
Original Publication Date: 1982-Nov-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bright, AA: AUTHOR

Abstract

In the manufacture of circuit chips, it is often convenient to provide identifying numbers for individual chips on a wafer. Also, for assembly of chips onto a board via C-4 solder pads, a mark on the back of the chip to indicate its orientation facilitates error-free assembly. These advantages are attained by the use of dry transfers on the back of the wafer during dicing. No additional process steps are required. Normally, an adhesive paper is applied to the back of the wafer to permit dicing of the wafer without damaging the table on which the wafer is placed. If this adhesive paper contains dry transfers, plus a printed grid for alignment to the chip array, numbers or orientation guides can be applied to the wafer.

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Chip Identification Techniques

In the manufacture of circuit chips, it is often convenient to provide identifying numbers for individual chips on a wafer. Also, for assembly of chips onto a board via C-4 solder pads, a mark on the back of the chip to indicate its orientation facilitates error-free assembly. These advantages are attained by the use of dry transfers on the back of the wafer during dicing. No additional process steps are required. Normally, an adhesive paper is applied to the back of the wafer to permit dicing of the wafer without damaging the table on which the wafer is placed. If this adhesive paper contains dry transfers, plus a printed grid for alignment to the chip array, numbers or orientation guides can be applied to the wafer. The dry transfers must be resistant to the solvents used for removal of the backing paper and of the photoresist protective layer on the front of the chips.

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