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Circuitizing Insulated Metal Substrates

IP.com Disclosure Number: IPCOM000050582D
Original Publication Date: 1982-Nov-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Mace, EW: AUTHOR [+2]

Abstract

There is presented a new process for utilizing logic-controlled drop-on demand devices to apply dielectric, conductive and resistive materials in circuit patterns on insulated metal substrates. The process is defined as follows: 1. Program desired circuit patterns in the application tool controller. 2. Position insulated metal substrate in suitable holder. 3. Apply the pattern. 4. Cure.

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Circuitizing Insulated Metal Substrates

There is presented a new process for utilizing logic-controlled drop-on demand devices to apply dielectric, conductive and resistive materials in circuit patterns on insulated metal substrates. The process is defined as follows: 1. Program desired circuit patterns in the application tool

controller.

2. Position insulated metal substrate in suitable holder.

3. Apply the pattern.

4. Cure.

This process permits rapid design changeover by simply reprogramming the controller. Improved line definition is achieved. Prototyping and short production runs are more easily and less expensively accomplished due to the elimination of artwork preparation and complex plating processes.

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