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Method and Apparatus for Curing Coated Substrates

IP.com Disclosure Number: IPCOM000050640D
Original Publication Date: 1982-Nov-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Lowen, AM: AUTHOR [+2]

Abstract

In the formation of metallized substrates for packaging I/C chips, one technique employs an insulating layer of polyimide as part of the multilayered circuitry of the substrate. After the application of a liquid polyamic acid coating, several heating steps are employed to cure the acid into a solid polyimide dielectric coating. The present apparatus and method provides a controlled heat during the second heating step, commonly referred to as the intermediate cure, without removing the substrates from etch racks.

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Method and Apparatus for Curing Coated Substrates

In the formation of metallized substrates for packaging I/C chips, one technique employs an insulating layer of polyimide as part of the multilayered circuitry of the substrate. After the application of a liquid polyamic acid coating, several heating steps are employed to cure the acid into a solid polyimide dielectric coating. The present apparatus and method provides a controlled heat during the second heating step, commonly referred to as the intermediate cure, without removing the substrates from etch racks.

As shown in Figs. 1 and 2, substrates 10, having polyimide coating 12 on the upper surfaces thereof, are placed in rack 14. The rack 14 has a pair of longitudinally extending openings 15, bounded by grooves 16. The substrates 10 are inserted into the grooves 16 with the slider 19 of end bar 18 open. After the substrates are inserted to form two lines, the slider 19 of end bar 18 is closed.

The rack 14 with the substrates 10 carried therein is placed onto an aluminum block 20, having a pair of raised flat ridges 22. The ridges are configured to mate with the openings 15 in the rack 14 to engage the undersides of the substrates 10. The plate, in turn, is placed on a hotplate maintained at a precisely controlled temperature.

To cure the coating on the substrate, the rack 14 with the supported substrates 10 is placed on the block 20. The tops of the ridges 22 are sufficiently high to contact the lower surfaces...