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Improving Adhesion Between Metal Surfaces and Polymers

IP.com Disclosure Number: IPCOM000050646D
Original Publication Date: 1982-Nov-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Appelt, BK: AUTHOR [+2]

Abstract

In the fabrication of printed circuit boards there are a variety of situations where one seeks to have an organic film adhere to a copper metallized surface. For example, one would like the copper surface to adhere to the underlying substrate and one would like photoresist applied on top of the copper to adhere to the copper.

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Improving Adhesion Between Metal Surfaces and Polymers

In the fabrication of printed circuit boards there are a variety of situations where one seeks to have an organic film adhere to a copper metallized surface. For example, one would like the copper surface to adhere to the underlying substrate and one would like photoresist applied on top of the copper to adhere to the copper.

It is known that hetero-aromatic compounds, such as benzotriazole or phenyl imidazole, will adhere to a copper surface.

It is possible to have copper adhere to a polymer or to an organic film by attaching a reactive group to the hetero-aromatic compound or to an organic complexing agent in general. When this modified compound is applied to the metal, it improves the adhesion between the metal and the organic coating.

The reactive groups which could be attached to the organic complexers include vinyl, epoxy, anhydride, amino, hydroxy and acrylic groups depending upon the interfaces between which one wants to achieve adhesion. These modified complexers may be used either as primers on a metallic and ceramic surface to which an organic coating must adhere, or they may be used as primers for organic surfaces and glass which are to receive a metallic coating (metal foil or other metal deposition), or they may be incorporated directly into the organic coating which is applied to a metallic surface.

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