Browse Prior Art Database

Protective Shield Solder Dam for Substrates

IP.com Disclosure Number: IPCOM000050666D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Aakalu, NG: AUTHOR [+3]

Abstract

A pre-punched plastic film 1 is heat and/or pressure bonded to the substrate 2 to act as a protective shield over the conductors 3 and any thick film resistors (not shown). Film also doubles as a solder dam around surface soldered components 4. Windows 5 are pre-punched on the film. By suitable selection of the material for the plastic film, it is possible to use high melting temperature solders, such as 95% lead/5% tin. It is also possible to operate such a substrate, populated with heat dissipating electronic components 4 at high temperatures (150 degrees C and above). Use of pre-punched film will increase production throughput over the slow heat cured, screen-printed thermoset materials. Polyether sulfone and thermoplastic polyimide are examples of materials for the plastic film 1.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Protective Shield Solder Dam for Substrates

A pre-punched plastic film 1 is heat and/or pressure bonded to the substrate 2 to act as a protective shield over the conductors 3 and any thick film resistors (not shown). Film also doubles as a solder dam around surface soldered components 4. Windows 5 are pre-punched on the film. By suitable selection of the material for the plastic film, it is possible to use high melting temperature solders, such as 95% lead/5% tin. It is also possible to operate such a substrate, populated with heat dissipating electronic components 4 at high temperatures (150 degrees C and above). Use of pre-punched film will increase production throughput over the slow heat cured, screen-printed thermoset materials. Polyether sulfone and thermoplastic polyimide are examples of materials for the plastic film 1. The substrate 2 can be large in size, and it could be ceramic, porcelain-coated steel, etc.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]