Browse Prior Art Database

Magnetic Head Assembly and Electronic Circuitry

IP.com Disclosure Number: IPCOM000050713D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Hitchner, JE: AUTHOR [+4]

Abstract

An integrated thin film head and electronic circuitry assembly employs a silicon layer 1 that is epitaxially deposited on a sapphire substrate 2. Integrated electronic circuitry 3 is formed on the silicon layer 1. Thin film heads 4 are then formed on the silicon layer 1 adjacent to the circuits 3. Electrical interconnections 5 are made to the head and integrated circuit by metalization or by wire bonding.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Magnetic Head Assembly and Electronic Circuitry

An integrated thin film head and electronic circuitry assembly employs a silicon layer 1 that is epitaxially deposited on a sapphire substrate 2. Integrated electronic circuitry 3 is formed on the silicon layer 1. Thin film heads 4 are then formed on the silicon layer 1 adjacent to the circuits 3. Electrical interconnections 5 are made to the head and integrated circuit by metalization or by wire bonding.

1

Page 2 of 2

2

[This page contains 1 picture or other non-text object]