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Browse Prior Art Database

Combined Reflow and Wave Soldering

IP.com Disclosure Number: IPCOM000050808D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

DeMarco, JL: AUTHOR [+2]

Abstract

Reflow of low temperature solder rings and wave soldering of a printed circuit board can occur during a single pass by immersion of the board in a preheating flux bath preceding the solder bath and then protecting the low temperature solder parts from the subsequent solder wave.

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Combined Reflow and Wave Soldering

Reflow of low temperature solder rings and wave soldering of a printed circuit board can occur during a single pass by immersion of the board in a preheating flux bath preceding the solder bath and then protecting the low temperature solder parts from the subsequent solder wave.

Referring to the figures, printed circuit board 1, held by a fixture (not shown), moves to the right along track 2 through flux bath 3 and across solder bath 4. The board carries power pins 5 having solder rings 6 and signal pins 7, the types of pins that are to be soldered in their respective holes. Power pins 5 are supported by base plate 8 secured to the stainless steel fixture that allows hot flux to flow about the pins from channel 9. The pins bottom on base plate 8, are held in alignment by temporarily placed polymeric block 10 and are urged downwardly by pad 11 held by cap 12 on the fixture. Signal pins 7 are held in position by retainer 13 also secured to the fixture.

As the fixture and board move through the flux bath, the power pins 5 and signal pins 7 are cleaned and the heat is sufficient to reflow the low temperature solder rings 6. Continued movement carries the board and fixture across solder wave 14 to solder signal pins 7. Base plate 8, however, protects the power pins 5 from being flooded by the solder wave 14.

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