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Integrated Modular Write Head for Non-Impact Printers

IP.com Disclosure Number: IPCOM000050818D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 3 page(s) / 41K

Publishing Venue

IBM

Related People

Chai, HD: AUTHOR [+5]

Abstract

Given the advantages of printing technologies that require only relatively low level energy input to effect printing, it is now possible to integrate the necessary printing elements or styli and their control circuits and drivers in one package. A suitable module technology, such as MLC (mult-level ceramic), would be employed to integrate the styli and their associated driver and control circuitry. See the figure.

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Integrated Modular Write Head for Non-Impact Printers

Given the advantages of printing technologies that require only relatively low level energy input to effect printing, it is now possible to integrate the necessary printing elements or styli and their control circuits and drivers in one package. A suitable module technology, such as MLC (mult-level ceramic), would be employed to integrate the styli and their associated driver and control circuitry. See the figure.

This integration of printing elements and any associated circuitry into a single print head unit containing all requisite elements is made possible by the low energy, electrochemical printing technology. This technology requires low voltage (as little as 15 volts has been used successfully), low current drain of about 3 milliamperes, and a reasonable pulse width requirement of about 500 Mus. For example, a 100 styli modular print head would require a total current of
0.3 ampere which is well within the present current carrying capability of ceramic modules and LSI (large-scale integration) chips.

As shown in the drawing, a feasible integrated print head would be packaged to consist of: a) a multilaminate module which contains internal multilevel conductive patterns for signal lines and interconnections; b) a plurality of write electrodes and ground bars, whose patterns are placed on an edge of the module by a suitable

technique such as sputtering or plating, which are connected

to predetermined ones of the signal lines and

interconnections of the module; and c) a plurality of pins, coupled to the signal lines, for inter...