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Gold Plated Nickel Pins for Thermal Conduction Module

IP.com Disclosure Number: IPCOM000050867D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

DiGiacomo, G: AUTHOR [+2]

Abstract

An alloy consisting of 99.50 per cent Ni, .10 - .15 per cent Cu, .15 - .20 per cent Fe, .15- .20 per cent Si, .005 - .007 S, and .05 - .1 per cent C has optimum physical, mechanical and metallurgical properties for pin application. The alloy avoids the problem of braze reaction with KOVAR(Trademark of Westinghouse Electric Corporation.) pins (which leads to weak joints), assures uniformity of joint strength, improves thermal conductivity, eliminates the need for plating KOVAR pins with Ni or Pd, and solves the problem of contact resistance due to Fe diffusion.

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Gold Plated Nickel Pins for Thermal Conduction Module

An alloy consisting of 99.50 per cent Ni, .10 - .15 per cent Cu, .15 - .20 per cent Fe, .15- .20 per cent Si, .005 - .007 S, and .05 - .1 per cent C has optimum physical, mechanical and metallurgical properties for pin application. The alloy avoids the problem of braze reaction with KOVAR(Trademark of Westinghouse Electric Corporation.) pins (which leads to weak joints), assures uniformity of joint strength, improves thermal conductivity, eliminates the need for plating KOVAR pins with Ni or Pd, and solves the problem of contact resistance due to Fe diffusion.

When KOVAR pins are used with a thermal conduction module (TCM), they are plated with Pd followed by Au. With a pin made of the instant Ni alloy, the Pd plating can be eliminated because there is no Fe diffusion to contend with. The Au plating on the Ni alloy pin should be about 2.25 - 2.5 microns. Although more Au is needed, eliminating the Pd, and the step of plating it onto the pin, results in substantial savings in material and process costs without sacrificing contact integrity. In addition, by diffusing Au at 560 /- 20 degrees C a diffusion zone of Au-Ni alloy about .75 - 1.25 microns thick is formed which can be tailored to specific requirements by temperature/time adjustments. This zone, produced by Ni diffusion into Au, is hard enough to prevent the connector from digging into the entire Au thickness during insertion, thus providing excellent co...