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Self Heating Test Chip for Reliability Life Test

IP.com Disclosure Number: IPCOM000050868D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Yu, CC: AUTHOR

Abstract

In accelerated reliability life tests for semiconductor products chips are stressed at elevated temperatures. Resistors on Q chip can be used as heating elements for temperature stressing.

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Self Heating Test Chip for Reliability Life Test

In accelerated reliability life tests for semiconductor products chips are stressed at elevated temperatures. Resistors on Q chip can be used as heating elements for temperature stressing.

In the self-heating test chip design, groups of unused resistors are brought out in parallel to the chip pads. These resistor chains serve as heating elements to heat chips to the desired junction temperature during reliability life tests. The junction temperature can be monitored by an in situ measurement of the forward voltage drop of an on-chip temperature diode. This temperature-sensitive voltage drop can be fed back to a control circuit that can regulate the power level delivered to the resistor chains, thereby maintaining a precise junction temperature during life tests. Using the same technique, one can do tester readout at high temperature either at module or wafer level.

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