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Nonthermal Curing of Polymide Films

IP.com Disclosure Number: IPCOM000050892D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Duran, J: AUTHOR [+3]

Abstract

One major limitation of polyimides has been the rather high temperature required for the polyamic acid to polyimide conversion; e.g., the preparation of devices using Josephson technology excludes the use of polyimides. The conversion of polyamic acid to polyimide has now been accomplished at room temperature with an electron beam. Anhydride and diamine were coated onto a substrate using dimethyl sulfoxide as a solvent. The sample was then placed in a vacuum chamber and exposed to an electron beam with current densities of .1 to 1 microamp per square centimeter. The infrared spectrum recorded in situ, before and after each dose, revealed that all of the characteristic absorptions associated with the polyamic acid and NH group disappeared with the formation of the characteristic absorptions for the polyimide.

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Nonthermal Curing of Polymide Films

One major limitation of polyimides has been the rather high temperature required for the polyamic acid to polyimide conversion; e.g., the preparation of devices using Josephson technology excludes the use of polyimides. The conversion of polyamic acid to polyimide has now been accomplished at room temperature with an electron beam. Anhydride and diamine were coated onto a substrate using dimethyl sulfoxide as a solvent. The sample was then placed in a vacuum chamber and exposed to an electron beam with current densities of .1 to 1 microamp per square centimeter. The infrared spectrum recorded in situ, before and after each dose, revealed that all of the characteristic absorptions associated with the polyamic acid and NH group disappeared with the formation of the characteristic absorptions for the polyimide.

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