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E Beam Curable Formulations for the Resistive Ribbon of Thermal Transfer Printing

IP.com Disclosure Number: IPCOM000050895D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chang, LS: AUTHOR [+2]

Abstract

Formulations of polyurethane acrylates, polyepoxy acrylates, and silicon-modified polyurethane acrylates which can be cured by electron beam at fast rates. The resistive layers formed from these E-beam curable formulations and coated on a 0.2-mil aluminized poly(ethylene terephthalate) in a 4-layer ribbon configuration demonstrated good strength adhesion and gave high quality prints at low currents and power when used in resistive ribbon thermal transfer printing.

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E Beam Curable Formulations for the Resistive Ribbon of Thermal Transfer Printing

Formulations of polyurethane acrylates, polyepoxy acrylates, and silicon- modified polyurethane acrylates which can be cured by electron beam at fast rates. The resistive layers formed from these E-beam curable formulations and coated on a 0.2-mil aluminized poly(ethylene terephthalate) in a 4-layer ribbon configuration demonstrated good strength adhesion and gave high quality prints at low currents and power when used in resistive ribbon thermal transfer printing.

Debris formation and burn-through were found to be minimal and occurred only at current levels higher than those required for good prints. Current levels for good prints varied from formulation to formulation, and the thickness of the resistive layer. But in general, high resolution and high density print have been obtained at 20-30 ma at voltages of 9-14 V.

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