Browse Prior Art Database

Josephson Device Packaging

IP.com Disclosure Number: IPCOM000050928D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Lahiri, SK: AUTHOR [+4]

Abstract

AB 1p. In the packaging of circuits employing Josphson tunneling devices, Pt pins are used to make electrical contact with Hg. It is desirable that the pin-tips be easily wettable with Hg so that the Hg droplets adhere to the pins during repeated insertion and removal of the pins into a pool of Hg, or immersion into Hg for long periods of time. A process is described for providing this wettability.

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Josephson Device Packaging

AB 1p. In the packaging of circuits employing Josphson tunneling devices, Pt pins are used to make electrical contact with Hg. It is desirable that the pin-tips be easily wettable with Hg so that the Hg droplets adhere to the pins during repeated insertion and removal of the pins into a pool of Hg, or immersion into Hg for long periods of time. A process is described for providing this wettability.

A thick layer of gold is deposited on the pins, with or without a thin Pd underlayer. The gold (and Pd underlayer) are deposited onto one surface of the Pt sheet from which the pins are to be made. The pins are made after the sheet is subjected to an inter-diffusion treatment which allows a limited penetration of Au into the Pt.

After this, the pins are formed in the usual manner by, for instance, electrodischarge machining and subsequent cleaning of the pin-tips.

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