Browse Prior Art Database

Zero Insertion Force Electrical Connector with Contact Wipe Action

IP.com Disclosure Number: IPCOM000050966D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 3 page(s) / 45K

Publishing Venue

IBM

Related People

Bauman, AH: AUTHOR [+2]

Abstract

In a cut-away isometric view, Fig. 1 illustrates a high density connector arrangement for connecting conductive pads on LSI cards to corresponding pads on inter-card connection boards. In addition to high connection densities, this arrangement provides other desirable connection characteristics such as contact wiping action, dust tightness, good retention, zero insertion force and economical manufacture.

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Zero Insertion Force Electrical Connector with Contact Wipe Action

In a cut-away isometric view, Fig. 1 illustrates a high density connector arrangement for connecting conductive pads on LSI cards to corresponding pads on inter-card connection boards. In addition to high connection densities, this arrangement provides other desirable connection characteristics such as contact wiping action, dust tightness, good retention, zero insertion force and economical manufacture.

Card 1 mates with board 2 at a 90-degree angle and is held securely by friction between the card surfaces and connector elements 3. The connector elements are bonded to clamping beams 4 which are held in position by spring 5. The amount of force used to retain the card and make electrical contact can be varied by the design of this spring.

Connector elements of the illustrated form are available commercially. One manufacturer offers a silicon rubber cylinder covered with a polyamide flex circuit of .003 inch gold-plated copper lines separated by .004 inch spaces. Another manufacturer offers a similar product with alternating layers of conductive and nonconductive elastomers. Alternatively, a spiral plated wire may be wound around an elastomer cylinder to form the connector elements, and after bonding the wire to the cylinder, the individual elements may be separated by making a single cut along the surface of the cylinder parallel to its axis.

Connections between conductive pads 6 on each side of the card and associated pads 7 on the board are made by connector element segments 3a. With pads on both sides of the card, the density of connection can be effectively doubled in relation to a one-sided configuration of card pads.

Figs. 2 and 3 show end views of the connection assembly with the clamping beams 4 respectively in open and closed positions. Note that the connector elements 3 are round in the open position and deformed in the closed position. The wedged information of the connector elements in the closed position produces a conta...