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Browse Prior Art Database

Induced Cooling in a Unit Cooling Scheme

IP.com Disclosure Number: IPCOM000050970D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Doody, GE: AUTHOR [+5]

Abstract

In certain data processing systems the requirements for the location of unit elements and ventilation may conflict so that a component which needs minimal cooling is excessively ventilated and receives more than its share of cooling, whereas densely packaged logic which requires maximal cooling may be in the path of heated air given off by other components and thereby requires additional cooling (e.g., by special or extra fans). The arrangement illustrated in Figs. 1 and 2 indicates how this problem can be resolved without any additional fans.

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Induced Cooling in a Unit Cooling Scheme

In certain data processing systems the requirements for the location of unit elements and ventilation may conflict so that a component which needs minimal cooling is excessively ventilated and receives more than its share of cooling, whereas densely packaged logic which requires maximal cooling may be in the path of heated air given off by other components and thereby requires additional cooling (e.g., by special or extra fans). The arrangement illustrated in Figs. 1 and 2 indicates how this problem can be resolved without any additional fans.

A single fan 1 mounted centrally within the equipment enclosure and below logic (CPU) gates 2 draws heated air through power supply 3 and unheated air through interior space 4. Ambient air is drawn into space 4 and the interior of supply 3 through holes in front door member 5. The diskette unit is cooled with low velocity fresh (intake) air, whereas the power supply, in direct line with the fan, is cooled by higher velocity air drawn by the fan. The logic gates 2 are cooled by a mixture of high velocity heated air taken from the power supply and high velocity fresh air taken from space 4.

Details of the power supply housing are shown in Fig. 3.

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