Browse Prior Art Database

Thermal Compound for Semiconductor Packages

IP.com Disclosure Number: IPCOM000051030D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Mondou, ER: AUTHOR [+2]

Abstract

The operation of highly integrated semiconductor devices generates a significant amount of heat which must be dissipated. This heat is conventionally dissipated by either backbonding the device to a suitable substrate and making some suitable cooling provision for the substrate, or, in the instance of flip-chip bonded devices, removing heat from the backside of the device with cooling pistons or other means that serve as a heat conduction bridge to fins or a cooling sink. A structure that can be used for cooling a device 10, solder bonded to substrate 12, is a layer of thermal grease 14 located between device 10 and finned cap 16.

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Thermal Compound for Semiconductor Packages

The operation of highly integrated semiconductor devices generates a significant amount of heat which must be dissipated. This heat is conventionally dissipated by either backbonding the device to a suitable substrate and making some suitable cooling provision for the substrate, or, in the instance of flip-chip bonded devices, removing heat from the backside of the device with cooling pistons or other means that serve as a heat conduction bridge to fins or a cooling sink. A structure that can be used for cooling a device 10, solder bonded to substrate 12, is a layer of thermal grease 14 located between device 10 and finned cap 16.

As packages become more complex, and more devices are mounted on the substrate, it becomes desirable to replace defective devices and/or correct defective solder bonds in order to increase yield. Such rework operations necessitate the removal of the device, solder, and thermal grease 14.

This thermal compound is formed from lamellar boron nitride particles of an average particle sizs in the range of 1-2 microns in an amount in the range of 50- 60 weight percent, combined with mineral oil which serves as a liquid carrier in the range of 40-50 weight percent. The compound has a thermal conductivity of > 1.25 watts/mater - degrees K while remaining electrically non-conductive, heat stable, non-contaminating and cleanable. The compound can be removed by any suitable solvent for the mineral oil whi...