Browse Prior Art Database

Sensitive Via Angle Monitor

IP.com Disclosure Number: IPCOM000051034D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Flachbart, RH: AUTHOR [+3]

Abstract

The present method of monitoring via sidewall angle is to measure the via string resistance on the test site of product wafers. Accept/reject criteria at post aluminum test is then invoked. This measurement is, however, greatly influenced by the interfacial resistance of the first to second level metal in the via hole.

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Sensitive Via Angle Monitor

The present method of monitoring via sidewall angle is to measure the via string resistance on the test site of product wafers. Accept/reject criteria at post aluminum test is then invoked. This measurement is, however, greatly influenced by the interfacial resistance of the first to second level metal in the via hole.

Elimination of the first metal from the test structure allows a Kelvin-type measurement of second metal resistance which is affected only by the via sidewall angle and the subsequent second metal thinning on the sidewall. The structure is shown schematically above. This structure can be incorporated in the product test site and the measurement made at post aluminum test. The data can be used independently, and the accept/reject criteria determined, or it can be used with existing data to determine a via sidewall angle problem or an interface problem between the first and second metals.

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