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Alignment and Distortion Correction Algorithm for MLC Laser Sizing Tool

IP.com Disclosure Number: IPCOM000051095D
Original Publication Date: 1982-Aug-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Chiaiese, VC: AUTHOR [+4]

Abstract

This technique solves the problem of laser cutting from multilayer ceramic (MLC) green laminates correctly sized substrates that have their top surface patterns centered and aligned on the substrates.

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Alignment and Distortion Correction Algorithm for MLC Laser Sizing Tool

This technique solves the problem of laser cutting from multilayer ceramic (MLC) green laminates correctly sized substrates that have their top surface patterns centered and aligned on the substrates.

When solid MLC green laminates are to be sized into individual substrates, the following problems are immediately evident: 1. The cutting matrix must be centered precisely over the

laminate pattern center.

2. The cutting axes must be parallel to the substrate axes

defined by the top surface features.

3. A method to compensate for laminate distortion must to

used. Top surface features do not retain their precise

punched/ screened (X,Y) distances. This is caused by the

sheet-aging process and pressures used in the lamination

process.

The following algorithm can be programmed into the laser-sizing tool software to neutralize these problems: Step 1: Using the cut axes as the reference, measure the

location of any two points A and B whose X,Y relationship to

themselves and to the laminate pattern center is known

(Fig. 1). Note, point B/1/ is where point B is expected

to be found.

Step 2: Calculate the angle of line AB and line AB with

respect to the cut axes. Subtracting these two angles gives

the angle by which the laminate must be rotated to align the

laminate and substrate axes with the cut axes (Fig. 2).

Step 3: Calculate the radial distance from point A to point B

and point A to point B/1/ using...