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Laser Sizing System Scrap Removal System

IP.com Disclosure Number: IPCOM000051097D
Original Publication Date: 1982-Aug-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Related People

Chiaiese, VC: AUTHOR [+4]

Abstract

A CO(2) circulating gas laser, rated at 1.2 kW, and continuously discharging infrared laser radiation at a wavelength of 10.6 Mum, is used to cut multilayer "unfired" ceramic substrates. The laser beam has a diameter of 0.0254 cm (0.010 in.) and is stationary. The laminate, mounted on a vacuum chuck assembly, is indexed under the laser beam. The required substrate tolerances can be designed for X, Y dimensions and for feature to edge centrality. various laser-cutting techniques are available to provide high qualities of cut edge profile and surface texture that are comparable to flat, vertical, sawed or milled edges.

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Laser Sizing System Scrap Removal System

A CO(2) circulating gas laser, rated at 1.2 kW, and continuously discharging infrared laser radiation at a wavelength of 10.6 Mum, is used to cut multilayer "unfired" ceramic substrates. The laser beam has a diameter of 0.0254 cm
(0.010 in.) and is stationary. The laminate, mounted on a vacuum chuck assembly, is indexed under the laser beam. The required substrate tolerances can be designed for X, Y dimensions and for feature to edge centrality. various laser-cutting techniques are available to provide high qualities of cut edge profile and surface texture that are comparable to flat, vertical, sawed or milled edges.

This technique solves the problems of how to remove scrap from laminates without interrupting the cutting operation, contaminating the substrates, or exposing the operator to ceramic dust.

Scrap pieces and dust are generated during the laser sizing of MLC (multilayer ceramic) green, laminates. The dust and scrap will interfere with the cutting process if allowed to remain in close proximity to the laminate. The dust also contaminates the finished substrates, binds up the table movements, and is a health hazard to the operator.

These problems are handled in the following manner. As the laminate pieces become free during cutting, the pedestal design of the vacuum chuck allows the pieces to fall down to a separation screen. The vacuum chuck and separation screen lie in an open cavity (see figure) through which ai...