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Permalloy Plating Base Removal

IP.com Disclosure Number: IPCOM000051181D
Original Publication Date: 1982-Aug-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Missel, L: AUTHOR

Abstract

The thin permalloy plating base found between desired magnetic propagation elements is removed by etching with a solution containing a soluble nitrate salt, oxalic acid or an oxalate salt, a secondary complexer and a wetting agent. Etching with this solution eliminates substrate attack and sidewall redeposition. An example of an etching solution of this type is as follows: sodium nitrate 150 g/1 oxalic acid 1 g/1 glycolic acid (70%) 30 ml/1 K n perfluorooctyl sulfonate 100 ppm plus sufficient HNO(3) or NaOH to provide a pH of 1.2 to 1.3.

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Permalloy Plating Base Removal

The thin permalloy plating base found between desired magnetic propagation elements is removed by etching with a solution containing a soluble nitrate salt, oxalic acid or an oxalate salt, a secondary complexer and a wetting agent. Etching with this solution eliminates substrate attack and sidewall redeposition. An example of an etching solution of this type is as follows: sodium nitrate 150 g/1

oxalic acid 1 g/1

glycolic acid (70%) 30 ml/1

K n perfluorooctyl sulfonate 100 ppm

plus sufficient HNO(3) or NaOH to provide a pH of 1.2 to 1.3.

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