Browse Prior Art Database

Silicon Drop on Demand Ink Jet Nozzle

IP.com Disclosure Number: IPCOM000051205D
Original Publication Date: 1982-Aug-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Brady, MJ: AUTHOR [+2]

Abstract

The article relates generally to ink jet nozzles and more particularly to the method of fabrication of a drop on demand ink jet nozzle.

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Silicon Drop on Demand Ink Jet Nozzle

The article relates generally to ink jet nozzles and more particularly to the method of fabrication of a drop on demand ink jet nozzle.

Referring to Figs. 1 and 2, a wafer 1 of (100) silicon is preferentially etched in an anisotropic etching bath using well known masking and etching steps to form a large area reservoir 2 for ink and a pipe section 3 which acts as a nozzle. The etched-out regions have a Vgroove in wafer 1. A large area piezoelectric transducer (PZT) 4 and a smaller area piezoelectric transducer 5 mounted on glass cover plates 6 are connected by field-assisted bonding to wafer 1 over reservoir 2 and pipe section 3, respectively. PZT C is biased while in position over reservoir 2, causing ink disposed therein to flow into pipe section 3. Pulses applied to PZT 5 force the meniscus of the ink formed at the end of pipe section 3 to separate from it, forming a stream 7 of separate drops. The resulting nozzles can be staggered and positioned in arrays to form multiple streams of drops.

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