Browse Prior Art Database

High Creep Strength Alloy

IP.com Disclosure Number: IPCOM000051336D
Original Publication Date: 1981-Jan-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chirono, OI: AUTHOR [+2]

Abstract

A high creep strength solder alloy system has the following composition Component % By Weight Sn 90 - 96 Bi 1 - 3 Ag 3 - 4 Sb 0.4 - 1.5.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

High Creep Strength Alloy

A high creep strength solder alloy system has the following composition Component % By Weight

Sn 90 - 96

Bi 1 - 3

Ag 3 - 4

Sb 0.4 - 1.5.

The four-component system is particularly useful where it is desired to use a cadmium-free solder alloy system, such as in the soldering of spring connectors where constant stress for long periods of time is induced in the solder joints.

1