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Browse Prior Art Database

Pneumatically Controlled Assembler

IP.com Disclosure Number: IPCOM000051338D
Original Publication Date: 1981-Jan-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Engel, PA: AUTHOR [+2]

Abstract

Pneumatically controlled assembler 10 is used to assemble, i.e., seat, cap or top T to substrate S of the pluggable module M.

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Pneumatically Controlled Assembler

Pneumatically controlled assembler 10 is used to assemble, i.e., seat, cap or top T to substrate S of the pluggable module M.

In operation, substrate S of module M is plugged via its input/output (I/O) pins P into a tool base fixture F. Substrate S carries a conductive pattern (not shown) on its upper surface. The heads of pins P, which extend through the upper surface of substrate S, are interconnected by the conductors of the pattern to the chip-bonding sites or pads, which are also part of the pattern. In turn, the I/O terminals (not shown) of chip C are bonded by reflow solder bonds B to the pads of the substrate circuit pattern. A metered quantity of thermal grease G is dispersed on the upper surface of chip C.

Cap T is then placed over substrate S, and assembler 10 is activated. As a result, plunger 11 is moved in a downward direction (see arrow A) under a controlled pressure or force which causes proper seating of the cap T onto the substrate S without damage to the chip or bonds B. By judiciously selecting the air pressure parameters P1 and P2 of the adjustable main valve 12 and bleeder valve 13, respectively, the assembly force is controlled to rise slowly enough to seat cap T on substrate S at an acceptable small and nondestructive force level and rate. Resilient pad 14, which is attached to the face of plunger 11, mitigates and/or absorbs the impact or striking force on the cap T at the initial point of contact.

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