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Fixture for Assembling Heat Sink to Module

IP.com Disclosure Number: IPCOM000051339D
Original Publication Date: 1981-Jan-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Kuntler, EW: AUTHOR [+2]

Abstract

Heat sinks H are affixed by an adhesive epoxy to the backside of metallized ceramic (MC) modules M in fixture 10.

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Fixture for Assembling Heat Sink to Module

Heat sinks H are affixed by an adhesive epoxy to the backside of metallized ceramic (MC) modules M in fixture 10.

Plural heat sinks H are first loaded into the base 11 of fixture 10. In particular, each heat sink H is inserted with its fins F facing inwardly into one of the two U-shaped channels 12, 13 of base 11 between adjacent locating cylindrical studs 14. Next, an uncured adhesive epoxy preform (not shown) is applied to the outer surface S of each heat sink H.

The fixture 10 is adapted to accommodate two different size rectangular, i.e., square, modules. To this end, four removable bars 15, of which only the two associated with channel 12 are shown, are inserted in the grooves 16 of the particular channel 12, 13 whenever modules of the smaller size W1 are to be processed by the particular channel. For processing the modules M of larger size W2, the bars 15 are removed as shown in channel 13. Likewise, the removable studs 14 are available in two different diameter sizes of the upper cylindrical guides 14a that are affixed to their respective bases 14b of studs 14. The smaller diameter size is used to accommodate the larger size W2 of module M which is placed between the two adjacent guides 14a. The larger size diameter is used to accommodate the smaller size W1 of module M. Alternatively, only the upper guides 14A are made removable from their respective bases 14B.

After the preform (not shown) is applied, the module M is inserted with its pins P facing in the outward dir...