Browse Prior Art Database

Conduction Cooling Structure for Solder Bonded Semiconductor Devices

IP.com Disclosure Number: IPCOM000051390D
Original Publication Date: 1981-Jan-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Ostergren, C: AUTHOR [+2]

Abstract

This structure conducts heat from a device or other heat source to a ca or cold Plate with spaced pin elements that accommodate for tilted devices and variations in the spacing of the device and cap.

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Conduction Cooling Structure for Solder Bonded Semiconductor Devices

This structure conducts heat from a device or other heat source to a ca or cold Plate with spaced pin elements that accommodate for tilted devices and variations in the spacing of the device and cap.

A requirement in microminiaturized semiconductor devices is that the heat generated during operation be removed from the device in order to avoid over- heating and subsequent destruction of the device. In semiconductor device packages where the device is solder-bonded to the supporting substrate, it is conventional to provide a thermal bridge between the backside of the device and a cap or cold plate. Forming the thermal bridge presents technical problems since there is normally a variation in the spacing of the devices to the cap, the devices are frequently tilted relative to the cap, and an accommodation must be made to provide for thermal expansion. In addition, any movable thermal bridge with a significant amount of mass can potentially break the device if the package is subjected to severe shock.

In this cooling structure, two space pins 1, each preferably provided with a flat surface 4, are positioned in contact with the top surface of device 2 and also in contact with the walls 6 of groove 8 in cap 10. As shown in Fig. 1, the flat 4 can be placed with the top surface of device 2 or, alternatively, in contact with the surfaces 6 of groove 8, as shown in Fig. 2. A spring element 5, located in g...