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Drilling of Multilayer Substrates with Laminated Metal Foil Interfaces

IP.com Disclosure Number: IPCOM000051423D
Original Publication Date: 1981-Jan-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Franklin, RH: AUTHOR

Abstract

This scheme reduces wander due to heat build-up in drilling multilayer circuit boards.

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Drilling of Multilayer Substrates with Laminated Metal Foil Interfaces

This scheme reduces wander due to heat build-up in drilling multilayer circuit boards.

The spindle 10 holding the drill bit 12 is designed to ride up and down on a rotating shaft. This allows the drill bit 12 to be raised and lowered several times, taking short and precise bits of material. As the drill bit rises out of the board between bites, it passes through a refrigerated or cryogenetically cooled guide plate 14. This keeps the drill bit 12 cooled, allows for a reference point, and guides the drill bit.

Laminated insulated metal foils 16 and 18 are placed on the bottom of the circuit board. When the drill bit 12 makes continuity between layers, a counter automatically counts the number of holes drilled.

A switch senses conduction between the guide plate 14 and the drill spindle. If the drill bit is off location and hits any portion of the guide plate, the drilling stops and the drill bit is recentered or replaced.

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