Browse Prior Art Database

Wire Sweeper for Circuit Device Manufacture

IP.com Disclosure Number: IPCOM000051424D
Original Publication Date: 1981-Jan-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Driscoll, RG: AUTHOR

Abstract

Fig. 1 shows a top view of a circuit device 2 having connection points formed in two columns. Wires that are connected to these points lie approximately in a channel 4 between the two columns. As representative wire segments 6 show, the wires may become mispositioned over the connection points 3 and thereby interfere with an operation to make further connections to points 3.

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Wire Sweeper for Circuit Device Manufacture

Fig. 1 shows a top view of a circuit device 2 having connection points formed in two columns. Wires that are connected to these points lie approximately in a channel 4 between the two columns. As representative wire segments 6 show, the wires may become mispositioned over the connection points 3 and thereby interfere with an operation to make further connections to points 3.

A tool for moving the wires away from the connection points and into channel 4 includes a sheet 7 of a thin flexible transparent material, shown in both Figs. 1 and 2. Sheet 7 has cut-away portions 8 that define flaps 9, which are bendable along a line parallel to the columns of connection points 3.

Sheet 7 is carried on a part 10 of the tool by a slide pin 12, and a spring 13 normally holds sheet 7 spaced downward from part 10. When the tool is lowered against the circuit device, legs such as 14 on sheet 7 hold the sheet at a predetermined space about the circuit device, but the slide pin 12 permits part 10 to continue to move downward. Part 10 carries pins 15 that engage flaps 9 as part 10 continues to move downward, and flaps 9 sweep the wires with the space 4, as is represented by arrows in Fig. 2.

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