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Browse Prior Art Database

Pin/Chip Carrier Assembly

IP.com Disclosure Number: IPCOM000051534D
Original Publication Date: 1981-Feb-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Jense, SM: AUTHOR [+3]

Abstract

Pin carrier 10 and chip carrier 20 are mechanically affixed to each other by plural fasteners, e.g., pin fasteners 30.

This text was extracted from a PDF file.
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This is the abbreviated version, containing approximately 72% of the total text.

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Pin/Chip Carrier Assembly

Pin carrier 10 and chip carrier 20 are mechanically affixed to each other by plural fasteners, e.g., pin fasteners 30.

Carrier 10 includes an insulative, e.g., ceramic, substrate 11 with plural holes
12. In each hole 12 is mounted an elongated conductive pin 13 which is affixed to substrate 11 between its head 14 and centrally formed bulge 15. Pins 13 are arranged in an appropriate input/output (I/O) pluggable array.

Substrate 21 of carrier 20 is, by way of example, a multilayer ceramic substrate. It includes plural conductive filled vias 22 that interconnect the outer and/or inner metallization planes 23, 24, 25. Outer plane 23 includes an array of bonding pads 26. Pads 26 are covered with a wettable solderable alloy deposit, such as Ni/Au, for better solder bonding adherence of a reflow solder bond 27, such as Pb/Sn alloy. The array of pads 26 corresponds to the array of pins 13 and is in alignment with the pin heads 14. The integrated circuit (I/C) chips, e.g., chip C, are mounted to the outer metallization plane 24 of substrate 21.

Prior to solder reflow bonding of the heads 14 to the pads 26 each pin fastener 30 with its preformed center stand-off bulge 31 is inserted in the respective pair of aligned holes 16, 28 of substrates 11 21 respectively. It should be understood that head 32 of pin 30 is not formed until after the pin 30 is inserted into hole 28. A concentric collar or washer 33 is bonded to the pin 30 by, for example, sold...