Browse Prior Art Database

Module Crimper Mechanism

IP.com Disclosure Number: IPCOM000051538D
Original Publication Date: 1981-Feb-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 79K

Publishing Venue

IBM

Related People

Kotrch, GS: AUTHOR

Abstract

Mechanism 10 (Fig. 1) crimps the four sidewalls W of a module thermal cap C to the module substrate S (Fig. 2).

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Module Crimper Mechanism

Mechanism 10 (Fig. 1) crimps the four sidewalls W of a module thermal cap C to the module substrate S (Fig. 2).

Mechanism 10 is operated by rotating handle lever 1 in a clockwise (CW) direction causing a corresponding movement of cam 2. This forces pivot blocks 3 to rotate clockwise about pivot shafts 4. The resulting inward motion of blocks 3 forces form blocks 5 and, more particularly, the inserted upright form pins 6 carried thereby against and into the sidewalls W. As shown in Fig. 2, substrate S rests on a locating block 7, and the tops of pins 6 and block 7 are coplanar. As pins 6 move inwardly, they force sidewalls W into aligned V-shaped grooves 8 (Fig. 3) of block 7. By adjusting the movement M of lever 1, the amount of deformation of the sidewalls W in grooves 8 can be controlled.

The action of mechanism 10 is such that the bottom edge E (Fig. 2) of substrate S is forced down against the bottom ledge L1 of the recess R formed in the sidewalls W at the correct position and is prevented from raising back up by the preformed upper ledge L2 of recess R. After the crimping operation, the assembled cap C and substrate S are released from mechanism 10 by returning the handle 1 to the solid outline position shown in Fig. 1.

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