Browse Prior Art Database

Module With Removable Heat Transfer Members

IP.com Disclosure Number: IPCOM000051549D
Original Publication Date: 1981-Feb-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Kunkler, EW: AUTHOR [+2]

Abstract

An integrated circuit (IC) module is packaged with a removable heat transfer member. The member has resilient fingers in contact with the internally mounted IC chip and is used to transfer heat from the chip to the module cap.

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Module With Removable Heat Transfer Members

An integrated circuit (IC) module is packaged with a removable heat transfer member. The member has resilient fingers in contact with the internally mounted IC chip and is used to transfer heat from the chip to the module cap.

In Fig. 1, each IC chip P is surrounded by a metal ring 10, e.g. copper, solder, etc., which has a pair of copper foil springs 11 affixed to its inside wall. The rings 10 act as spacers to maintain a uniform gap between the ceramic substrate S and aluminum cover C. Thus, the heat is transferred from the top of the chip P through the springs 11 and ring 10 to the cover C. The spring action of the coil springs 11 compensates for any mismatch in the mounting heights H of the chips P. Furthermore, the members 10 and springs 11 may be coated with a thin film polymer, such as parylene. The coating would thus provide corrosion protection, mitigate electrical cross-talk between chips P, and/or reduce galvanic cell action between the different metal parts, should the ring 10, members 11 and cap C be of different metals. The member 10 may be held in place by a suitable bonding agent, such as glue, or, alternatively, by compression of the cover C towards the substrate S.

Instead of providing an individual heat transfer member 10 for each chip P, a planar metal member 100, as shown in Figs. 2 and 3, may be used which covers all the chips P mounted in the module. Stamped out of the member 100 are resilient fingers arranged...