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Wafer Thinning and Chemical Polishing Machine

IP.com Disclosure Number: IPCOM000051572D
Original Publication Date: 1981-Feb-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Hause, JR: AUTHOR [+2]

Abstract

Semiconductor wafer thinning and chemical polishing machine 1 has a motor 14 mounted on support plate 2, which also mounts the support columns 3 and anchors the pressure control cylinders 4. Motor 14 drives internal shaft 15, wafer nest 10 and the liquid circulating pump (not shown). Control cylinders are attached by external shaft 6 to top plate 9 and act through shaft 6 to control the forces applied to the surfaces of the wafers by top plate 9 and bottom plate 11. Motor 5 is arranged to rotate shaft 6 in either direction at various speeds.

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Wafer Thinning and Chemical Polishing Machine

Semiconductor wafer thinning and chemical polishing machine 1 has a motor 14 mounted on support plate 2, which also mounts the support columns 3 and anchors the pressure control cylinders 4. Motor 14 drives internal shaft 15, wafer nest 10 and the liquid circulating pump (not shown). Control cylinders are attached by external shaft 6 to top plate 9 and act through shaft 6 to control the forces applied to the surfaces of the wafers by top plate 9 and bottom plate 11. Motor 5 is arranged to rotate shaft 6 in either direction at various speeds.

Processing tank 12 supports bottom plate 11 and contains the processing fluid. Tank 12 has a slot 16 for fume exhaust and dump valves 13 for maintaining the fluid level when closed and for draining acid rinse water when opened. A metering valve 7 is provided for acid feed to tank 12 and a slot (not shown) connected to a water manifold (not shown) for the rapid introduction of rinse water. Cover plate 8 slides on columns 3 to open the assembly.

In operation, cover plate 8 is opened, which exposes wafer nest 10, and the wafers (not shown) are loaded. Cover plate 8 is lowered so that the wafers and nest 10 are sandwiched in contact with top plate 9 and bottom plate 11. The pressure applied by top plate 9 is varied from no contact to the maximum available pressure by cylinders 4. Top plate 9 and nest 10 are rotated in either direction at varying speeds by motors 5 and 14, respectively...