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Etchant for Positive Photoresists

IP.com Disclosure Number: IPCOM000051589D
Original Publication Date: 1981-Feb-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bazot, M: AUTHOR [+2]

Abstract

It has been demonstrated that the addition of formic acid in a small quantity (for example, 10%) in N methyl-pyrrolidone improves significantly the stripping abilities of the latter for positive photoresists.

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Etchant for Positive Photoresists

It has been demonstrated that the addition of formic acid in a small quantity (for example, 10%) in N methyl-pyrrolidone improves significantly the stripping abilities of the latter for positive photoresists.

Using this technique, the surface charge ratio of the substrate is considerably reduced.

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