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Heat Sink Technique for Electrical Components

IP.com Disclosure Number: IPCOM000051656D
Original Publication Date: 1981-Feb-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 19K

Publishing Venue

IBM

Related People

Larson, WB: AUTHOR

Abstract

A packaging technique is described for electrical components comprisin the placement of the components within a heat conducting enclosure along with a dielectric grease or equivalent material.

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Heat Sink Technique for Electrical Components

A packaging technique is described for electrical components comprisin the placement of the components within a heat conducting enclosure along with a dielectric grease or equivalent material.

This technique is applicable to all electrical components whether they are encapsulated in glass, plastic or ceramic and includes transistors, diodes, capacitors, resistors, coils, RC modules or any combination of these components. The component module 10 is placed within a good heat- conducting encapsulating material 12 along with a dielectric material, such as silicone grease 14. The silicone grease assures a good thermo-conductive path from all surfaces of module 10, thereby increasing significantly the thermal operating point of the module.

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