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N, N Diethylaminotrimethyl Silane as an Adhesion Promoter for Photoresists

IP.com Disclosure Number: IPCOM000051750D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Barry, JA: AUTHOR [+3]

Abstract

A silane adhesion promoter provides superior photoresist adhesion without the dewetting of the photoresist from the substrate.

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N, N Diethylaminotrimethyl Silane as an Adhesion Promoter for Photoresists

A silane adhesion promoter provides superior photoresist adhesion without the dewetting of the photoresist from the substrate.

N,N-diethylaminotrimethyl silane (TMSDEA) is deposited on a semi conductor substrate prior to photoresist coating. The substrate surfaces which are coated include silicon dioxide, silicon nitride, and polysilicon. TMSDEA provides improved adhesion compared to other conventionally used adhesion promoters, such as HMDS, and avoids the problem of dewetting of the resist from the substrate which sometimes occurs with other silane adhesion promoters. The TMSDEA can be vapor deposited as well as solution coated.

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