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Silicon Coated Anode Plate for Sputtering

IP.com Disclosure Number: IPCOM000051751D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Joseph, RR: AUTHOR [+2]

Abstract

An anode plate of quartz is coated with a layer of silicon to provide more uniform contact and a more uniform sputtered quartz layer deposition.

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Silicon Coated Anode Plate for Sputtering

An anode plate of quartz is coated with a layer of silicon to provide more uniform contact and a more uniform sputtered quartz layer deposition.

A quartz plate is usually used as an anode, wafer-holding plate in floating- mode sputtered SiO(2) deposition. The sputtered SiO(2) thickness uniformity is affected by the resputtering potential established on the quartz plate. The resputtering potential is in turn affected by, among other things, the anode of the sputtering system and by the conditions of the contact between the quartz plate and the anode. Any irregularities in the contacts will have adverse effects on the SiO 2 thickness uniformity. However, a quartz plate with a coating of sprayed Si (or other conductive material will minimize the adverse effects of non-uniform contacts by providing a more uniform potential along the quartz plate surface.

The sprayed Si layer can be on the bottom side or top side (or both sides, if desired) of the quartz plate.

The Si-coating, which is resistant to HF acide attack, also helps to prevent the quartz plate from thickness loss during HF acid cleaning.

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