Browse Prior Art Database

Packaging Method for Gas Panel

IP.com Disclosure Number: IPCOM000051782D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-10
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Barkhuff, ED: AUTHOR [+2]

Abstract

A plasma display panel comprises a pair of glass plates, each plate comprising a conductor array with a layer of refractory dielectric insulating the conductors from the gas. Typically the conductor arrays are terminated on the edge portion or apron of the panel. A cost-effective method of packaging a plasma display panel in which relatively short boards or cables, populated with small, surface-mounted chip carriers, are connected directly to the apron of the panel is constructed as follows:

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Packaging Method for Gas Panel

A plasma display panel comprises a pair of glass plates, each plate comprising a conductor array with a layer of refractory dielectric insulating the conductors from the gas. Typically the conductor arrays are terminated on the edge portion or apron of the panel. A cost-effective method of packaging a plasma display panel in which relatively short boards or cables, populated with small, surface-mounted chip carriers, are connected directly to the apron of the panel is constructed as follows:

Referring to Fig. 1, a gas panel 11 includes an apron or edge termination 13 for containing the drive system. A narrow driver board 15 is mounted on the panel apron 13 and contains the required logic, input, select lines and drive busses mounted in encapsulated chip carrier packages 17. Relatively small board size is achieved because little space is required for the chip carrier packages 17, and also because the surface-mounted carriers require no through- holes in the board. A two-sided sealing tape 21 is used to attach the driver/circuit board 15 to the apron, and to seal the apron of the panel against the environment. The tape includes an opening or window for exposing the termination pads of conductors 23, which in turn are connected through flexible strip 19 to the leads 25 of chip carrier packages 17. Thus, the drive and logic circuits provided from the chip carrier packages 17 are interconnected to the gas panel conductors through the fle...