Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Enclosure for Electro Optical Components

IP.com Disclosure Number: IPCOM000051814D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

Rasko, GA: AUTHOR

Abstract

Enclosure 10 includes a formed body 20 and an attachable lid 30 for mechanically holding and optically coupling a variety of electro-optical components 40, such as phototransistors and light-emitting diodes on a printed-circuit board.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Enclosure for Electro Optical Components

Enclosure 10 includes a formed body 20 and an attachable lid 30 for mechanically holding and optically coupling a variety of electro-optical components 40, such as phototransistors and light-emitting diodes on a printed- circuit board.

Body 20 contains a channel 21 formed to receive the body 41 of a component 40. Slots 22 provide clearance for flange 42 and for leads 43. Leads 43 are bent to project through holes 23, which are spaced at standard distances for alignment with conventional circuit-board grids. Body 2O may be held on a circuit board by means of leads 43 alone, or in combination with a fastener or adhesive. Lid 3O is preferably held on body 20 with an adhesive.

Other optical components (not shown), such as waveguides or filters, may additionally be placed along the length of channel 21. Tabs, keys or other conventional alignment means may be formed in body 2O or lid 30 to align components 4O properly or to prevent misassembly.

1

Page 2 of 2

2

[This page contains 5 pictures or other non-text objects]