Browse Prior Art Database

Bonding and Encapsulation of Ceramic Wafer

IP.com Disclosure Number: IPCOM000051834D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Feulner, RA: AUTHOR [+2]

Abstract

A piezoelectric transducer is bonded to the glass print head of an ink jet printer and encapsulated for environmental protection with an ink resistant film in one processing operation.

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Bonding and Encapsulation of Ceramic Wafer

A piezoelectric transducer is bonded to the glass print head of an ink jet printer and encapsulated for environmental protection with an ink resistant film in one processing operation.

The piezoelectric transducer 10 is pre-assembled with the glass print head 12 and a suitable protective film 14, such as a polyimide film, in a spaced-apart configuration by spacer shims 16. A low viscosity adhesive 18 is applied at the edge of the pre-assembled components, and the adhesive flows between the parts until it reaches the edge of the protective film, which is cut slightly larger than the piezoelectric transducer.

This bonding technique provides complete encapsulation of the piezoelectric transducer with a thin uniform repeatable bond line of low mass to produce uniform transducer response. The polyimide film, which covers the surface of the transducer, provides excellent environmental protection.

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